Electronics Packaging  
  A selection of images from recent projects, primarily showing:
  • ECAD data-transfer allowing for accurate space management of pcb's
  • Wiring harness layout and design of routes using Pro/Cable functionality.
  • Heat sink design utilising heat-pipe technology and CFDesign software.
  19" rack design  
  19" rack system - our involvement included the full mechanical design and integration of the electrical and environmental requirements of the specification. Ensuring strict adherence to the the EMC requirements and structural integrity of a large 8U bespoke system including full thermal management was critical.

New mechanisms were developed for manual access of line cards and fan modules, working with manufactures and end users to ensure that performance of these key build and maintenance operations were as good or better than the marketplace.

 
 
 
  Rugged Enclosures  
  Working with Richard Bush Limited allowed us to develop a new enclosure for a GPS mapping system. It included a novel approach to producing a low volume product that looked and felt modern and rugged without the huge investment usually associated with this type of professional product.
  BDL Broadcasting equipment
  Here we worked with BDL, an established supplier to the broadcasting industry, re-developing the identity of their product and put in place a family design, where the products kept their roots but were able to deliver many sizes of device, using a cost effective design
  AGFA An industrial duplex A3+ electrostatic printer   
 

Here the project included paper path definition R & D test machine design, and the liaison with Japanese subcontract engineers to incorporate best in class paper handling. Several Patents were issued during this development project.

     
 

All PTC Logos are used under license from Parametric Technology Corporation, Needham, MA, USA. 

All CFdesign logos are used under license from Blue Ridge Numerics USA

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